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Press Release
Wooptix and Prodrive Technologies sign declaration of intent for strategic partnership

Wooptix and Prodrive: Strategic Partnership

Wooptix and Prodrive Technologies sign declaration of intent for strategic partnership The partnership is aimed at supporting Wooptixs’ development in semiconductor metrology through WaveFront Phase Imaging (WFPI) SCIENCE PARK EINDHOVEN (date, 2024) Prodrive Technologies and Wooptix have signed a memorandum of understanding to further strengthen their long-term strategic partnership. The partnership is aimed at supporting […]

Press Release
ASMC

Wooptix in ASMC 2024

Wooptix in ASMC 2024 The semiconductor metrology expert will present on May 14th at ASMC with the Title 3D shape measurements of patterned silicon wafers Madrid 13th May 2024. Wooptix, the semiconductor metrology expert using Wavefront Phase Detection, has presented today at the Advance Semiconductor Manufacturing Conference (ASMC). The event is taking place from May […]

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Semiconductor Industry Outlook 2024

Wooptix moderates the Semiconductor Outlook 2024

Wooptix moderates the Semiconductor Industry Outlook 2024 New growth engines will drive semiconductor industry: Auto and Industrial   The Semiconductor Industry Outlook 2024, the event organized by SEMI to provide the most relevant conclusions about the Semiconductor Industry from its leaders, was moderated by Wooptix. “The semiconductor industry is  accustomed to cycles and has weathered many ups and […]

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Gartner Forecasts

Gartner Forecasts Worldwide Semiconductor Revenue to Grow 17% in 2024   Gartner Forecasts Worldwide Semiconductor Revenue to Grow 17% in 2024 Semiconductor Revenue to Total $624 Billion in 2024 Semiconductor Revenue to Decline 11% in 2023 Deployment of Workload Accelerators in Servers to Increase to More Than 20% by 2027 Global semiconductor revenue is projected […]

Press Release

Semicon Europa

Wooptix: Latest solution for on-product overlay for wafer-to-wafer bonding processes Wooptix, with its advanced silicon wafer shape measurement technique, is set to be an important contributor to the future of Semiconductor Advanced Packaging        To accomplish the challenging task of accurately overlaying two wafers during the hybrid wafer-to-wafer bonding process, an accurate wafer shape […]