PAPERS

Our Work

Wooptix is always working and researching, deepening more and more in the novelties of the technological sector and of each one of our technologies and solutions, it is a sector in constant movement in which new products appear every day. We frequently publish papers in various digital and physical media.
New wafer shape measurement technique for 300mm blank vertically held silicon wafers / June 2023

New wafer shape measurement technique for 300mm blank vertically held silicon wafers / June 2023

Juan M. Trujillo-Sevilla, Óscar Casanova-González, Alex Roqué-Velasco, Javier González Pardo, Jose Manuel Ramos-Rodríguez, Jan O. Gaudestad

Wave Front Phase Imaging (WFPI) is a new technique for measuring the free shape of a silicon wafer. To avoid the effects of gravity affecting the wafer shape, the silicon wafer is held vertically while measured using a custom made three-point wafer holder. The wave front phase is measuring using a non-coherent light source that is collimated and then reflected off the silicon wafer surface. The wave front phase is measured…

read more
New wafer shape measurement technique for 300mm blank vertically held silicon wafers / June 2023

Wave front phase imaging for silicon wafer metrology / October 2022

Juan M. Trujillo-Sevilla, Alex Roqué-Velasco, Miguel Jesús Sicilia, Óscar Casanova-González, José Manuel Rodríguez-Ramos, Jan O. Gaudestad

Wave Front Phase Imaging (WFPI) is a new wafer shape measurement technique that acquires millions of data points in just seconds or less, on a full 300mm silicon wafer. This provides lateral resolution well below 100μm with the possibility of reaching the lens’ optical resolution limitation between 3-4μm…

read more
New wafer shape measurement technique for 300mm blank vertically held silicon wafers / June 2023

New wave front phase sensor used for 3D shape measurements of patterned silicon wafers / September 2022

Juan M. Trujillo-Sevilla, Óscar Casanova-González, Alex Roqué-Velasco, Miguel Jesús Sicilia, Javier González Pardo, José Manuel Ramos-Rodríguez, Jan O. Gaudestad

On product overlay (OPO) is one of the most critical parameters for the continued scaling according to Moore’s law. Without good overlay between the mask and the silicon wafer inside the lithography tool, yield will suffer1. As the OPO budget shrinks, non-lithography process induced stress causing in plane distortions (IPD) becomes a more dominant contributor to the shrinking overlay budget2. To estimate the process induced in-plane wafer distortion after cucking…

read more
New wafer shape measurement technique for 300mm blank vertically held silicon wafers / June 2023

Stria measurement using wave front phase imaging on a transparent plate / October 2021

Juan M. Trujillo-Sevilla, Oscar Casanova-González, Miriam Velasco-Ocaña, Sabato Ceruso, Ricardo Oliva-García, Óscar Gómez-Cárdenes, Javier Martín-Hernández, Alex Roqué-Velasco, Alvaro Pérez-García, José Manuel Rodríguez-Ramos, Jan O. Gaudestad

Wave Front Phase Imaging (WFPI) is used to measure the stria on an artificial, transparent plate made of Schott N-BK7® glass material by accurately measuring the Optical Path Difference (OPD) map. WFPI is a new technique capable of reconstructing an accurate high resolution wave front phase map by capturing two intensity images at different propagation distances. An incoherent light source generated by a light emitting diode (LED) is collimated and transmitted through the sample…

read more
New wafer shape measurement technique for 300mm blank vertically held silicon wafers / June 2023

New metrology technique for measuring wafer geometry on a full 300mm silicon wafer / October 2021

Álvaro Pérez-García, Juan M. Trujillo-Sevilla, Óscar Casanova-González, Miriam Velasco- Ocaña, Sabato Ceruso, Ricardo Oliva-García, Óscar Gómez-Cárdenes, Javier Martín-Hernández, Alex Roqué-Velasco, Álvaro Pérez-García, Jose Manuel Ramos-Rodríguez, Jan O. Gaudestad

The flatness of the silicon wafers used to manufacture integrated circuits (IC) is controlled to tight tolerances to help ensure that the full wafer is sufficiently flat for lithographic processing. Advanced lithographic patterning processes require a detailed map of the wafer shape to avoid overlay errors caused by depth-of-focus issues1. A large variety of new materials are being introduced in Back-End of Lines (BEOL) to ensure innovative architecture for new applications. The standard in-line control plan for the BEOL layer deposition steps is based on film thickness and global stress measurements which can be performed on blanket wafers to check the process equipment performance. However, the challenge remains to ensure high performance…

read more
Monocular Real Time Full Resolution Depth Estimation Arrangement with a Tunable Lens / March 2022

Monocular Real Time Full Resolution Depth Estimation Arrangement with a Tunable Lens / March 2022

Ricardo Oliva-García, Sabato Ceruso, José G. Marichal-Hernández and José M. Rodriguez-Ramos

This work introduces a real-time full-resolution depth estimation device, which allows integral displays to be fed with a real-time light-field. The core principle of the technique is a high-speed focal stack acquisition method combined with an efficient implementation of the depth estimation algorithm, …

read more
The optics of the human eye at 8.6 µm resolution / December 2021

The optics of the human eye at 8.6 µm resolution / December 2021

Wooptix’ team with the collaboration of Damien Gatinel & Jack T. Holladay

In this work, we characterize the in vivo ocular optics of the human eye with a lateral resolution of 8.6 microns, which implies roughly 1 million measurement points for a pupil diameter of 9 mm. The results suggest that the normal human eye presents a series of hitherto unknown optical patterns. This discovery could have a great impact on the way we understand some fundamental mechanisms of human vision.

read more