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// bonding On-Product Overlay

Shape Measurement
Technique for Wafer-to-Wafer

This new technique is available for wafer shape measurements of both single and bonded wafers. Knowledge of the shape can be used for finding voids and particles in between the two wafers.

Additionally, with advanced finite elements method (FEM) algorithms, one can calculate the predicted in plane distortions (IPD) for improved on product overlay (OPO), which is critical for successful hybrid bonding.

shape measurement

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