Utilizing a distinctive vertical wafer grip, PHEMET metrology system offer comprehensive measurement of both front and back wafer surfaces simultaneously, eliminating the impact of gravitational distortion.
Phemet® offers a singular measurement yields a range of wafer metrics, including:
Warp and bow
In-plane displacement
Stress-induced local curvature
Variation in wafer thickness and flatness
Nanotopography (NT) of both front and back surfaces